Manual operation consumes huge time and requires undivided attention for a prolonged period. Handling massive projects relying solely on manual operation can be a costly mistake, you do not wish to afford. Solderability testing is about evaluating the solderability of wires, terminations and other things (including lead) or an electronic component. There are different methods to perform solderability testing. Solderability test equipment is available in the market to help the users effectively conduct thorough testing.
What does the testing serve?
Opt for equipment that comes in complete adherence with all current standards observed in the industry. The testing helps to avail of a way by which we can determine the solderability of system package terminations. The test also serves to provide for steam conditioning to ensure effective simulation of the condition of the components after continuous storing for a prolonged period. Always keep this in mind that the solderability of termination or a lead and as such components are determined by its solder wetting traits.
Popular Testing Methods
These are supposed to be paired with some other surface employing PB-free solder. Two popular methods are there that are adopted to test the solderability—Surface Mount Process Simulation Test and Dip & Look Test.
Surface Mount Process Simulation Test -We perform surface mount simulation testing via screen printing a specific solder mixture (paste-like consistency) onto the surface of a ceramic plate. After this, we position the component onto the paste, following a particular convection reflow profile. You can use this type of solderability testing method on every possible surface mount components. Even BGA and CGA ones that are unsuitable for using the dip and look method can benefit from this testing method.
Dip and Look method– We perform dip and look solderability testing by exposing the electronic components to 0-8 hours of steam conditioning constantly. Post this steam conditioning phase, the terminations of the components are immersed in the solder mixture in a controlled way. This monitoring becomes possible utilizing a specific kind of activated rosin flux. It is followed by a strict inspection done according to the criteria specified. This type of method is most commonly used for testing the solderability of certain components.
Important Features and Configurations to Look for
Look for suitable solderability test equipment that can cater to your solderability testing requirements in the best way possible. Generally, a 15-lb capacity solder pot paired with an effective flux station and a robust axis control system can serve the best. Table-top or bench-top equipment features a modular compact design that does not consume extra space around unnecessarily. Their compact design also makes that portable. The equipment should come installed with a user-friendly interface in full English so that the operator can easily manage its usage. High precision PLC motion monitoring system and touch screen programming further will add more utility value to the testing machine.
For lead and lead-free testing, you must search for a machine that also features effective configuration with a double solder station. Photon Steam Aging System feature will help in aging the components (artificially) before the solderability dipping test. Sasinno can help you avail of a wide range of pro-grade equipment or machines for soldering and testing the solderability.